Joining Technology Product List and Ranking from 7 Manufacturers, Suppliers and Companies | IPROS

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

Joining Technology Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. Tohoku Techno Arch Co., Ltd. Miyagi//Educational and Research Institutions
  2. 大成プラス Tokyo//others
  3. null/null
  4. 4 三重電子 Mie//Trading company/Wholesale
  5. 4 ベルホフ Aichi//Facility Design Office

Joining Technology Product ranking

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. Tohoku Univ. Technology:Room temperature wafer bonding:T24-033 Tohoku Techno Arch Co., Ltd.
  2. Metal and resin injection molding bonding technology "NMT treatment" 大成プラス
  3. Dissimilar Metal Joining Technology 'AKROSE HYBRID(R)'
  4. Dissimilar Metal Joining Technology "AKROSE(R)"
  5. 4 Dissimilar Metal Joining Technology "AKROSE(R) Q&A"

Joining Technology Product List

1~14 item / All 14 items

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Mitsui Electronics Co., Ltd. Business Introduction

We handle OEM production of finished products from substrates, LCD modules, and production equipment.

We handle OEM production of finished products from substrates, LCD modules, and production equipment, as well as micro-joining technology for electronic components, and component mounting and connection using ACF and other methods. Mie Electronics is expanding its business scope based on its long experience in the assembly of electronic products, including the mounting of chip components onto substrates, the design and manufacturing of LCD displays, and the design and manufacturing of mechatronics. Additionally, in the electronics field, where miniaturization, weighing, and mobility are advancing, we focus on "joining technologies" such as microfabrication, micro-joining technology, and high-density mounting technology. For more details, please download the catalog.

  • Parts and Materials
  • Joining Technology

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Injection Molding Joining Technology 'NMT' [Can be made into parts without assembly!]

Strongly bond plastic to metal at the molecular level! Technology using two-color molding of metal and resin.

At Daisei Plus Co., Ltd., we offer a technology for integrated molding using injection molding of metals and resins called 'NMT (Nano Molding Technology).' By applying surface treatment to metals, we create nano-level dimples on the metal surface. This groundbreaking technology generates a strong bonding force by incorporating hard resins. It enables the development of new products that achieve weight reduction of metal exterior components such as housings and bodies. 【Features】 ■ Bonding strength (shear strength) = 40 MPa or more ■ The strong bonding of various resins and metals allows for greater freedom in product design ■ No degradation of bonding strength after thermal shock testing ■ Aluminum can be used in high-temperature and high-humidity environments ■ Nano-order dimples can be formed in a short time *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Joining Technology

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Metal and resin injection molding bonding technology "NMT treatment"

Strongly bond plastic to metal at the molecular level! Forming nano-order dimples in a short time.

We would like to introduce our company's injection molding bonding technology for metals and resins, called "NMT Treatment." By performing "NMT Treatment," we uniformly form very stable dimples of 20 to 50 nm on the metal surface. By embedding resin into these fine dimples through injection molding and allowing it to crystallize, a strong bond can be achieved. The strong bonding of various resins and metals allows for greater freedom in product design. 【Features】 ■ Bonding strength (shear strength) = over 40 MPa ■ The strong bonding of various resins and metals allows for greater freedom in product design ■ After thermal shock testing (-55℃/1H ⇔ 150℃/1H × 3000 cycles), there is no degradation in bonding strength (equivalent to a 10-year specification for automotive engine rooms) ■ Aluminum can be used in high-temperature and high-humidity environments (after testing at 85℃/85% RH × 8000 hours, there is no degradation in bonding strength) ■ Nano-order dimples are formed in a short time *For more details, please refer to the PDF materials or feel free to contact us.

  • Processing Technology
  • others
  • Joining Technology

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Aluminum die casting and iron joining technology

In recent years, we propose a fastening method for aluminum die casting, which is widely used in automotive-related parts.

Aluminum die casting (hereinafter referred to as ADC), which is a special cast product, has been used in various fields in recent years as a material that can instantaneously mold precision parts. It has high strength and excellent castability, but it also has low ductility, and there are very challenging aspects from the perspective of fastening. Among our many products, we would like to introduce fasteners and fastening methods that can be used for fastening ADC with different materials. 1. Self-piercing rivet RIVSET Easily mechanically joins different types of materials without pre-drilling. It is also possible to fasten three or more materials. 【Features】 ■ Fastening of dissimilar metals ■ No pre-drilling required ■ High static and dynamic strength 2. Fasteners for resistance welding WELTAC A method that enables resistance welding with the underlying iron material by driving in iron rivets. We provide riveting equipment and rivets other than welding machines. Currently, there are six types of rivets available that can be used according to applications such as material and plate thickness. 【Features】 ■ Enables spot welding of dissimilar materials. ■ Usable for aluminum and cast materials from 0.8 to 3.2 mm ■ Can fasten up to 2 to 4 sheets ■ Compatible with adhesive use

  • Housing structure technology/long-term superior housing technology
  • Joining Technology

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Interface Adhesion Analysis and Next-Generation Adhesive Bonding Technology

A unique book that analyzes and evaluates adhesive interfaces in three-dimensional and complex ways using a new method, summarizing adhesive interface phenomena in spacetime across different scales.

Various attempts to identify factors leading to destruction and degradation are explained. The development of new adhesives applying new analysis techniques for adhesive bonding interfaces and a detailed explanation of next-generation adhesive bonding technologies are also provided!

  • Structural Survey
  • Other analytical equipment
  • Joining Technology

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Tohoku University Technology: Technology for easy and strong resin/metal bonding: T19-064

Dry process, low cost, quick& simple joining technology!

Conventional technologies for joining metal and resin include mechanical fastening with rivets, bolts, nuts, etc. and adhesive bonding, but the former has problems such as poor airtightness and increased number and weight of parts in the bonding area, while the latter has low adhesive strength due to the lack of adhesives for thermoplastic resins and low reliability in long-term use.  The present invention relates to a technology for joining resin and metal simply, firmly, quickly, and at low cost, which differs from the above methods in that it is a dry process, does not require expensive equipment, and is not a wet process, thus eliminating the need for waste liquid treatment.

  • others
  • Joining Technology

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Tohoku University Technology: Joining Solid Metals: T24-079

It can strongly bond phase-separated metals that could not be traditionally joined in metallurgy while maintaining the shape of the components.

The technology for joining dissimilar metals is expected to contribute to weight reduction of vehicles such as automobiles, trains, and aircraft, improving safety and speed performance, as well as reducing CO2 emissions through lightweighting. However, depending on the types of metals, poor compatibility between materials can lead to phase separation, making joining difficult. The inventors developed a method for joining incompatible metals, such as Fe and Mg, using the de-alloying method as described in Patent No. 6710707. By pre-diffusion bonding an Fe-Ni intermediate layer to the tip of the Fe, and then heating the Fe-Ni intermediate layer in contact with Mg, de-alloying occurred. Only Ni was de-alloyed from the intermediate layer to the Mg side, and Mg filled the gaps in the porous structure of Fe, resulting in a composite structure where Fe and Mg were intertwined at the joint interface, achieving a strong Fe-Mg mechanical bond. Additionally, by utilizing the decrease in melting temperature associated with the Mg-Ni alloy reaction, the joint interface could be liquefied while maintaining the shape of the joined materials, thus promoting de-alloying. At the same time, pressure was continuously applied to expel the alloy liquid, which becomes brittle upon solidification, to the outside.

  • others
  • Joining Technology

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Joining technology that does not melt materials 'Friction Stir Welding' [Joining prototype in progress!]

It's not welding; it achieves low distortion and joint strength close to the base material through solid-state bonding! We help improve conventional welding defects and reduce weight!

At Keihin Ramtech, we have introduced FSW (Friction Stir Welding) and have accumulated expertise in joining technology. We also possess multiple lathes and machining centers, allowing us to provide consistent support from machining to assembly. If you have not adopted FSW before, please feel free to consult us for design support compatible with FSW. We are capable of joining for various industries, from pilot production to large-scale mass production. Please consult us for joining prototypes with various materials and shapes. If you have any requests, please contact us. 【Features】 - Capable of achieving low-distortion joints by minimizing heat input during joining. - Specialized in joining difficult-to-weld materials, applicable to various materials. - Excellent joinability achieved through mechanical processes. *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Joining Technology

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Tohoku Univ. Technology:Room temperature wafer bonding:T24-033

Silicon wafer bonding via polysilazane

 Recently, silicon wafers are required to be bonded to each other in the fields of semiconductors and MEMS devices. However, since the conventional wafer bonding technology requires bonding at a high temperature, thermal stress and warpage in the wafer makes the circuit failure.  This is the simple wafer bonding technology which can be bonded to each other simply by overlapping and pressurizing the other silicon wafer via plasma treated polysilazane coating.  This technology doesn't require the high-temperature bonding process, which is expected to increase the yield of semiconductor and MEMS devices.

  • others
  • Joining Technology

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Non-melting joining technology 'Friction Stir Welding' [Joining prototype in progress!]

Not welding, but achieving low distortion and joint strength close to the base material through solid-state bonding! We will help improve conventional welding defects and reduce weight!

At Keihin Ramtech, we have introduced FSW (Friction Stir Welding) and have accumulated expertise in joining technology. We also possess multiple lathes and machining centers, allowing us to provide consistent support from machining to assembly. If you have not previously adopted FSW, please feel free to consult us for design support compatible with FSW. We are capable of joining for various industries, from pilot production to large-scale mass production. Please consult us for joining prototypes with various materials and shapes. If you have any requests, please contact us. 【Features】 ■ Enables joining with minimal heat input and distortion during the process ■ Specializes in joining difficult-to-weld materials and can be applied to various materials ■ Achieves excellent joinability through mechanical processes *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Joining Technology

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New baking processing technology and welding joining technology for carbon fiber.

Development of mass production systems through automation and robotics! It will be possible to solve issues.

Carbon fiber used in automotive body materials and applications requiring hardness typically involves a method where epoxy resin is coated on non-baked carbon fiber, followed by the application of heat to promote resin exchange. Our company has developed a high-speed baking processing technology that is more than several times faster than conventional baking processing machines. We believe that establishing a mass production system through automated robotics will solve existing issues. Additionally, welding of carbon fiber has become possible with our specially developed welding jigs, which is expected to enable broader applications of carbon fiber. **Features** - Maintains strength superior to conventional methods, allowing for weight reduction of over 1/10 (compared to our own standards) - No corrosion whatsoever - Creates a safe working environment with no spray dissolution - Significant reduction in total work processes and costs (specification of colors, reduction and simplification of painting equipment, shortening of painting processes and processing times, simplification of storage management for painted parts and products) *For more details, please refer to the PDF materials or feel free to contact us.*

  • Joining and fastening materials
  • Joining Technology

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